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ASMC currently operates two wafer fabrication facilities, both of which are located in Caohejing High-Tech Park in Shanghai, PRC. Fab 1/2 was originally managed and operated independently as fab 1 and fab 2 to manufacture 5-inch and 6-inch wafers, respectively. However, ASMC consolidated the management and operations of fab 1 and fab 2 in February 2005 to increase efficiency as it continues to convert its existing 5-inch wafer capacity to 6-inch wafer capacity. The table below sets out a summary of its current organization of fabs in operation:
| Fab |
|
Fab 1/2 |
Fab 3 |
| Cleanroom class |
|
Cleanroom 1 : Class 10 |
Class 1 |
| |
|
Cleanroom 2 : Class 1 |
|
| Production began |
|
Cleanroom 1 : 1992 |
2003 |
| |
|
Cleanroom 2 : 1996 |
|
| Cleanroom size (sq meters) |
|
4,531 |
6,000 |
| Wafer size |
|
5-inch/6-inch |
8-inch |
| Smallest linewidth |
|
0.6 micron |
0.25 micron |
| Process technologies used in manufacturing |
|
Bipolar, BiCMOS, EEPROM, HVMOS |
BiCMOS, EEPROM, HVMOS |
Under the current organization, fab 1/2 consists of two cleanrooms, cleanroom 1 (originally fab
1) and cleanroom 2 (originally fab 2). Cleanroom 1 is a class 10 wafer fab and, as at December 31,
2005, was equipped to produce approximately 28,000 5-inch wafers and 15,000 6-inch wafers per month, based primarily on the bipolar process technology with a minimum linewidth of 1.5 microns. Cleanroom 2 is a class 1 wafer fab and, as at December 31, 2005, was equipped to produce 36,000
6-inch wafers per month, based primarily on BiCMOS and EEPROM technologies with a minimum
linewidth of 0.6 micron. The cleanroom in fab 3 is a class 1 wafer fab with designed capacity of 30,000 8-inch wafers per month, and is capable of producing wafers with a minimum linewidth of 0.25 micron, based primarily on BiCMOS and EEPROM technologies. As at December 31, 2005, fab 3 had a monthly capacity of 12,000 8-inch wafers.
In order to satisfy the customers' needs for 6-inch wafers, ASMC began converting part of its 5-inch wafer capacity in cleanroom 1 in fab 1/2 to produce 6-inch wafers since December 2003, and may further converts 5-inch wafer capacity to produce 6-inch wafers in the future depending on customer demand.
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