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The cleanroom in fab 3 is a class 1 wafer fab with designed capacity of 30,000 8-inch wafers per month, and is capable of producing wafers with a minimum linewidth of 0.25 micron, based primarily on BiCMOS and EEPROM technologies. As at December 31, 2005, fab 3 had a monthly capacity of 12,000 8-inch wafers.
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