| |
|
|
|
|
|
Under our current organization, fab 1/2 consists of two cleanrooms, cleanroom 1 (originally fab 1) and cleanroom 2 (originally fab 2). Cleanroom 1 is a class 10 wafer fab and, as at December 31, 2005, was equipped to produce approximately 28,000 5-inch wafers and 15,000 6-inch wafers per month, based primarily on the bipolar process technology with a minimum linewidth of 1.5 microns. Cleanroom 2 is a class 1 wafer fab and, as at December 31, 2005, was equipped to produce 36,000 6-inch wafers per month, based primarily on BiCMOS and EEPROM technologies with a minimum linewidth of 0.6 micron. |
|
|
