ASMC's testing services for memory, logic and mixed devices and backend services of grinding support its fab activities. Testing services range from testing program development to wafer probing, failure analysis and reliability testing. The testing and grinding division are equipped with sophisticated facilities that can address customers' specific needs such as high-voltage probing, low-current probing, Multi-die probing , very thin wafer grinding and advanced automation features. ASMC has also established a strong network of partners who provide assembly, packaging and distribution to bring complete solutions for the customers.